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MPU6050不能贴了吗？
5***9A
121
3
说是没有接地开窗，这个芯片不需要接地开窗的好不好！
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袁***(5***9A) 2020-08-07 11:44:14
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11.4.2 Exposed Die Pad Precautions
The MPU-60X0 has very low active and standby current consumption. The exposed die pad is not required for heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce performance changes due to package thermo-mechanical stress. There is no electrical connection between the pad and the CMOS.
The MPU-60X0 has very low active and standby current consumption. The exposed die pad is not required for heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce performance changes due to package thermo-mechanical stress. There is no electrical connection between the pad and the CMOS.
官方工作人员(5***26)
2020-08-08 18:41:15
您好，这个器件因内部封装没有做接地，在自动做钢网的时候没有做接地开口。等我们程序更新后，此器件可以上架。
官**工(2***6A)
2020-08-07 11:21:12
0
C24112 这个物料封装有问题临时下架，暂时不贴。
袁***(5***9A) 2020-08-07 10:49:38
0
开窗影响芯片平整度，2月份刚贴了，现在准备小批量，结果不贴了，你们技术水平有点差啊！
官方工作人员(5***26)
2020-08-08 18:27:04
您好，请您把板子图片及相关情况在系统中投诉，我们工作人员联系您处理，谢谢！
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